Utilizing Electrical Test Methods for Thermal Measurement, Reliability and Quality Assessment ūüóď

conference meeting

Utilizing Electrical Test Methods for Thermal Measurement, Reliability and Quality Assessment


We continue our sequence of in-depth tech events for the year with a talk on test methods for electronic devices

From multi-core chips in slim smartphone devices or compact packaging of power semiconductor modules for lightweight electric vehicle inverters, understanding semiconductor package heat dissipation remains important for performance and product reliability purposes.

This presentation introduces electrical test methods covered by JEDEC 51-1 standards.  By utilizing this approach, the difficulties and problems measuring temperature at the component’s die are overcome.  Further use of the techniques allow transient thermal response measurement, for package and system thermal characterization, which can be applied to identifying thermal degradation, verifying package material quality for manufacturing purposes, and supporting thermal design processes by generating validated semiconductor package thermal models. This method is an alternative to XRay, CSAM or destructive inspection methods for certain failure diagnosis applications.

Key topics:

–¬†¬†¬†¬†¬†¬†¬†¬†¬†¬†Electrical test methods for thermal measurement, JEDEC 51-1 series, transient thermal response & structure functions

–¬†¬†¬†¬†¬†¬†¬†¬†¬†¬†Package material structure object mapping

–¬†¬†¬†¬†¬†¬†¬†¬†¬†¬†Power Electronics ‚Äď IGBT thermal degradation identification & power cycling studies

–¬†¬†¬†¬†¬†¬†¬†¬†¬†¬†Package Material Defect Identification

–¬†¬†¬†¬†¬†¬†¬†¬†¬†¬†Recent IP developments in detailed thermal model calibration

Following this there will a general discussion, Q&A and update on the current state of landscape (recent major annoucenments will be also shared)

 

Date and Time

Location

Staticmap?size=250x200&sensor=false&zoom=14&markers=42.6688483%2c 83

Contact

Registration

  • No Admission Charge
  • Starts¬†05 March 2018 09:22 AM
  • Ends¬†28 March 2018 09:22 PM
  • All times are US/Eastern
  • Menu: Vegetarian Pizza, Cheese Pizza, Regular Soda Pop, Diet Soda Pop

 

Speakers

Joe Proulx

Joe Proulx of Mentor Graphics

 

Topic:

Utilizing Electrical Test Methods for Thermal Measurement, Reliability and Quality Assessment

 

Agenda

6:00 PM РWelcome and Introductions, Chapter business update, Pizza

 

6:15 PM РMain Presentation: Utilizing Electrical Test Methods for Thermal Measurement, Reliability and Quality Assessment

 

7:30 PM РPost event discussion, Q&A and landscape update

 

7:45 PM РWrap Up

 

7:45 to 8 PM РNetworking

 

 

 

A Joint Oakland University/IEEE Computer Society/Education Chapter Presentation, open to all