2017 IEEE International Professional Communication Conference (ProComm) 🗓

— (IEEE PCS) -technical, or scientific, engineering communication, learning, theory, lead-edge developments …

Sponsored by the IEEE Professional Communication Society
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Dates: July 23-26, 2017
Location: University of Wisconsin, Madison
All aspects of engineering, technical, or scientific communication. The conference is for practitioners, teachers, engineers, technical professionals, and associated fields alike. Attended by hundreds of professionals from around the world, ProComm (formerly known as IPCC) is held annually at different locations around the world. ProComm offers an opportunity for colleagues and experts to meet and learn from one another. Sessions offer both fundamental and leading-edge developments in communication theory and technology.
Find out more here: sites.ieee.org/pcs/procomm2017

2017 IEEE Power & Energy Society General Meeting 🗓

— (PES) – keynotes, sessions, tutorials, classes, “Energizing a More Secure, Resilient & Adaptable Grid” …

Sponsored by the IEEE Power & Energy Society
Meeting theme: Energizing a More Secure, Resilient & Adaptable Grid
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Dates: July 16-20, 2017
Location: Sheraton Chicago Hotel & Towers, 301 East North Water Street, Chicago

Six half-day tutorials: including a variety of topics including Synchrophasors Estimation and Control, DERs, IEEE 1547 Standard, Microgrids, and Challenges in Cascading Analysis.
Seven full day tutorials: encompassing a wide range of topics including, IEEE C62.22, Energy Storage, Smart Inverters, HVDC, Cybersecurity, shunt compensation, and Distribution Automation/Management Systems.
Find out more here: www.pes-gm.org/2017

Volunteers Needed: Over 200 volunteers are needed to perform a wide range of roles, including welcoming, directing people, assisting with sessions and coordinating. Volunteer shifts are in blocks with a minimum of 4 hours, and volunteers will earn an hour of meeting attendance, excluding paid events such as the tutorials, dinners or receptions, for every hour of volunteer time. Lunch or dinner will be provided for volunteers taking two shifts back to back.

THE IEEE ROCK RIVER VALLEY SECTION PRESENTS THE 2017 EMC SEMINAR 🗓

THE IEEE ROCK RIVER VALLEY SECTION PRESENTS THE 2017 EMC SEMINAR EM Field-Based Design of Circuit Boards for First Pass EMC Compliance Daniel Beeker Questions? Please contact: Jamal Shafii – Jamalshafii@ieee.org Phone: 608-658-6830 Steve Davidson steve.davidson@ieee.org Phone: 815-218-8249 For more information visit our website: http://sites.ieee.org/rockrivervalley/events/emcseminar/ To Register Now: https://goo.gl/M5DDqH This seminar will consist of four sessions. The first session will explain how electromagnetic fields behave on circuit boards. Material presented will focus on the basic principles and physics of electromagnetic energy. It will be presented in easy to understand language with plenty of diagrams. Attendees will discover how understanding the behavior of EM fields can help to design PCBs that will be more robust and have better electromagnetic compatibility performance. In the second session, techniques to improve EMC performance of circuit boards will be discussed. A new design approach that utilizes an electromagnetic physics-based design methodology to control the field energy in your design will be presented. The third session will focus on a simple EM physics- and geometry-based approach for designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed can be used to reduce powersupply noise and improve EMC. The final session will be on PCB design to survive transients. This session will cover some definitions of ESD and EOS while explaining the important differences in the energy involved and the resulting damage and design to mitigate transients. The session will also review PCB design for improving system robustness. Attendees will have the opportunity to network with EMC and Test Equipment vendors. Past seminars have featured up to 30 exhibitors! With more than 39 years of experience in electronic system design and EMC, Daniel Beeker provides applications support for NXP Automotive customers worldwide. Daniel also supports NXP customers globally with special function development tools and instrumentation (almost all of the “LFxxx” tools on the NXP website). Daniel worked for Freescale Semiconductor before Freescale and NXP merged in 2015. Daniel also specializes in EMC and signal integrity design techniques for systems and PCBs. In support of this, Daniel has completed more than 200 PCB design evaluations for customers and internal NXP products. Daniel teaches field based design techniques at NXP and industry conferences worldwide; more than 70 sessions with more than 3500 attendees since 2010. Daniel is also involved with NXP IC package design and IC development tool teams to support improved EMC performance, working on more than 20 IC designs. Specialties: Microprocessor and Microcontroller development tools, PCB layout techniques for EMC and signal integrity, and Automotive applications specialist. Rockford, Illinois is located just over an hour’s drive from Chicago’s O’Hare airport. Direct bus service from Chicago/O’Hare airport is available. There are several hotels within few blocks of the Giovanni’s Conference Center. For more information about things to see and do in Rockford, Visit https:// www.gorockford.com/ Seminar Overview Session 1 – Understanding how Electromagnetic Fields behave on Circuit Boards Session 2 – First Pass EMC Circuit Board Design: Techniques to Improve Performance Session 3 – Power Distribution Made Easy Session 4 – PCB Design to Survive Transients June 13, 2017 7:30 AM – 6:00 PM Giovanni’s Restaurant and Conference Center Rockford, IL Seminar Registration IEEE Members $125.00 Non-IEEE Members $175.00 IEEE Student Members $60.00 Group Rate (4 + from same corporation), please call. Seminar Fee includes seminar attendance, a copy of the presentation material, and breakfast, lunch, and refreshments. Registration help for payment: Adrian Vandergrift aevandergrift@ieee.org 815-226-2518

TU-Automotive Detroit 2017 🗓

— presentations, panel discussions, roundtables, start-up pitches, networking, exhibition …

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TU-Automotive Detroit 2017: 17th Annual Connected Car Conference and Expo. With 150 speakers, a 200,000 sq ft exhibition and 3000 attendees, TU-Automotive Detroit is the world’s biggest conference & expo for connected & autonomous cars. Come to TU-Automotive Detroit 2017 to see, hear and meet the brightest & best in our industry. Download the brochure now to find out more.
— Presentations — Panel Discussions — Roundtables — Start-Up Pitches — Networking — Exhibition
June 7-8 • The Suburban Collection Showplace, Novi, MI

Where The Auto Tech Industry Comes To Do Business. Find out more here:
www.tu-auto.com/detroit

“As an OEM, being able to meet new companies that otherwise you couldn’t get acquainted with easily is really important in this space…it’s good to see what everyone else is doing as well.”
– Subaru
“It was a great opportunity to share visions about the future of connected mobility”
– Zipcar

Government and Engineering Conference: IP, Workforce, Vehicles 🗓

— (EEE SEM) – speakers on intellectual property, aerospace policy, immigration, autonomous vehicle policy …

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Wednesday, May 17, 5:30-8:30 P.M.
Location: VisTaTec Center, 18600 Haggerty Rd, Livonia
Ever wonder how engineers protect their intellectual property? Or are immigration concerns keeping the USA workforce competitive? Or how government policies will drive drone and autonomous vehicle development? These are some of the questions that highlight where Engineering and Government collide. Join IEEE Southeast Michigan as we collect experts from several areas to give presentations and answer your questions on how government policies affect your everyday activities. This will be an interactive forum and all viewpoints are welcome to interact.
Speakers include experts on:
Intellectual Property
Aerospace Policy
Immigration
Federal Policy
Autonomous Vehicle Policy

Confirmed Speakers:
Denise Sylvester – Regional Outreach Officer for the Elijah J. McCoy Midwest Regional United States Patent and Trademark Office located in Detroit, Michigan
Russell T. Harrison – Director of IEEE-USA,
Philip Hall – Chair of CTAP – the IEEE-USA Committee on Transportation and Aerospace (inc. Space)
Jennifer Dukarski – Shareholder at Butzel Long – Autonomous Vehicle Policy: The Impact of Law and Regulations on Design and the Industry
Robert Neff – Sales and Marketing Insight – Strategic Consulting, Analysis and Planning Intrass – At the forefront of V2V Communication
Ravi Nigam – Attorney – Immigration Law
The registration fee is only $20 ($10 for students) and includes a plated dinner! Come ask your questions and learn how engineering collides with our government in everyday life. Space is very limited, register today!
The event will also include an overview of IEEE and opportunities for getting involved and volunteering.

Register at: https://meetings.vtools.ieee.org/m/45241

The event is partially funding by an IEEE Region 4 PACE grant.

IEEE Young Professionals/Students Social Networking Dinner 🗓

IEEE Young Professionals/Students
Social Networking Dinner
Saturday, May 13, 2017 @ Lincoln, NE

This Free Networking Dinner event is open to all Young Professionals, Students, Both IEEE and Non IEEE members. The event will take place the night before the EIT Workshop & Conference: Project Management & Design for Six Sigma, Lincoln, NE.So, It is a great Opportunity to mingle with Industry Experts, early-career professionals, IEEE Officers, Conference Attendees and Speakers from a broad range of industries.

Join us for a fun night and make new connections.

The goal of the event is to bring together students and early-career professionals in a broad range of industries, including engineering, science, business, marketing, arts, media and entrepreneurship. Time is Running out, RSVP Soon.

Date: Saturday, May 13, 2017 Time: 6:00 pm

Registration: Free Event – RSVP required. Open to all.

Register for Free at:
https://meetings.vtools.ieee.org/m/45406

Location: ​​
SINGLE BARREL: Restaurant & Bar
130 North 10th Street
Lincoln, NE 68508-3601
402.904.4631

​​Join Us on Facebook: Stay connected with Other Fellow YP from the Region at https://www.facebook.com/groups/260575284107397/ (IEEE Region 4 Young Professionals)

Connect on LinkedIn:
https://www.linkedin.com/in/umamatasnia
​ ​
Also, Feel free to Register For the Workshop at Discounted Rate:

Project Management & Design for Six Sigma

2017 EIT Workshop& Conference –

Sunday May 14, Lincoln, NE

Date: March 14, 2017 Time 2:00 pm to 5:30pm

Nebraska Union, University of Nebraska, City Campus

1400 R St. Lincoln, NE 68588

Reserve your spot Today:
http://www.eit-conference.org/eit2017/reginfo.asp

The Conference is geared Towards Students and young Professionals and will focus on Latest Technology, Professional Career growth and Innovation.

Contact Person:
Umama M Tasnia
​IEEE Central USA Region 4 Young Professional Chair
umama.tasnia.us@ieee.org

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IEEE
445 Hoes Lane, Piscataway, NJ 08854, USA
http://www.ieee.org/

Regards

Young Automotive Professionals Conference (YAPC) 🗓

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Date: Saturday, June 17, 2017
Time: 8:30 a.m. – 3:30 p.m.
Location: Ford Dearborn Development Center
20050 Oakwood Blvd., Dearborn

SAE Detroit Section along with this year’s host, Ford Motor Company, invite you to attend the 14th Annual YAPC. The event will include prominent industry leaders in a panel discussion and Q&A on the topic of “Autonomous Vehicles”. The afternoon highlight will be a Ride & Drive event featuring some of Ford’s most exciting vehicles on various courses.

The conference is open to anyone 18 years and older (Ride & Drive requires valid driver’s license) and is a great opportunity to network with young professionals in the automotive industry.

Agenda
8:30 a.m. – 9:30 a.m. Registration/Continental Breakfast
9:30 a.m. – 10:00 a.m. Keynote Speaker, Ford Motor Company
10:00 a.m. – 12:00 p.m. Panel Discussion and Q&A
12:00 – 12:30 p.m. Networking Lunch (box lunch included)
12:30 – 3:30 p.m. Ride & Drive

Important Note: Only 150 spots available. Register by June 1 to save! Registration closes June 15 at 4:00 p.m. (or when sold out). There will be no onsite registration or refunds after June 9.
REGISTER AT: www.sae-detroit.org
Speakers and vehicles are subject to change.

Hosted by Ford Motor Company

Tuesday, May 16 Nissan TITAN Vehicle Event 🗓

Tuesday, May 16
Nissan TITAN Vehicle Event
5:30 – 8:30 p.m.
Burton Manor
27777 Schoolcraft Rd., Livonia

Agenda
5:30 – 6:30 p.m. Social Hour sponsored by Cummins Inc.
6:30 – 7:30 p.m. Dinner
7:30 – 8:30 p.m. Presentation

SAE members and guests will have the opportunity to hear a presentation from key members of the Nissan Team surrounding the development of the TITAN.

Speakers
Brent Hagan, Sr. Manager Product Planning – SUVs and Trucks, Nissan North America
Elma Avdic, Director of Light Duty On Highway Engineering, Cummins, Inc.
Todd Schiller, Senior Manager, Vehicle Performance Development – Truck
Nissan Technical Center North America
Scott Hallner, Senior Manager – Reliability Testing, Nissan Technical Center North America

Flyer

Important Note: Registration will close Friday, May 12 at 4:00 p.m. (or when sold out).
There will be no onsite ticket sales and no refunds after May 9.

For more information, email Julie Beattie or call (248) 324-4445 ext. 1.

IEEE CANADA CCECE2017 INDUSTRY FORUM 🗓

Hi Mohamed,

Please add to the ewavelengths.

Regard.

Benjamin Doerr
e-Wavelengths Editor and SEM Section Communications Director
b.doerr@ieee.org


+1.248.987.8260

———- Forwarded message ———-
From: Esrafil Jedari
Date: Thu, Apr 27, 2017 at 11:40 AM
Subject: You are invited: IEEE CANADA CCECE2017 INDUSTRY FORUM
To: Kimball Williams , Benjamin Doerr

Dear Benjamin,
Dear Kimball,

Please distribute the following announcement about FREE Industry forum in the CCECE 2017 to your contacts who may be interested to join.
Conference breakout will be available for all event attendees.

Regards,

Esrafil Jedari, SMIEEE
Patronage Chair, CCECE2017 Conference
ejedari@ieee.org
Vice-chair, IEEE Windsor Section
Research Assistant, Department of Electrical and Computer Eng.
University of Windsor, Room 2199, CEI, 401 Sunset Ave. Windsor, ON N9B 3P4
Phone: (519) 3001501

You are invited to the following FREE event:
IEEE CANADA CCECE2017 INDUSTRY FORUM
Event to be held at the following time, date, and location:
Monday, 1 May 2017 from 1:45 PM to 3:50 PM (EDT)
Caesars Windsor Hotel

Attend Event
Share:
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The IEEE Canada Industry Relations Committee together with the CCECE 2017 Conference invites you to attend a forum on innovation and regional development. The forum will be composed of industry leaders; technology startup entrepreneurs; government regional development and granting agency representatives; technology transfer, commercialization and investment leaders. Panelists will share with you their vision, experience and advice on advancing technology to drive our future manufacturing and economy as a whole.

5G Summit: Making 5G a Commercial Reality 🗓

— (ComSoc) -architectures, approaches, MIMO, handling IoT, new radios, regulations, trends …

THEME: “How Close Are We To Reality?”
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Webinar Date: Thursday, April 20, 2017
Time: All day – 8:30 AM – 5:30 PM (EDT)
KEYNOTE SPEAKERS: – Marcus Weldon, CTO, Nokia; – Durga Malladi, SVP, Qualcomm; – Seizo Onoe, CTO, NTT DOCOMO; – Dave Wolter, Assistant VP, AT&T; – Henning Schulzrinne, CTO, FCC; – Seong-Mok Oh, CTO, KT; – Asha Keddy, VP, Intel
Location: on the Web
Cost: none (a $350 value!)
RSVP: required
Event Details & Registration: register.comsoc.org/brooklyn-5g-summit-2017

Summary: The fourth annual Brooklyn 5G Summit will present trends aimed at discovering “what´s working and what´s not”, and the best approaches in overcoming the challenges of making 5G a commercial reality. It will cover overall 5G end-to-end system design across the entire spectrum range, 5G regulatory aspects and 5G pre-commercial systems. Discussions will also focus on various use cases for 5G in the evolving Internet of Things (IoT) space by inviting selected start-up companies to share their work in multiple areas.
Hear leading experts explain and discuss:
— 5G New Radio: Waveforms, Numerology, Coding
— 5G Massive MIMO
— 5G Network Architecture
— 5G Proof-of-Concept (PoC) System
— 5G IoT

The 4th Brooklyn 5G Summit via live streaming video is brought to you by National Instruments in cooperation with the IEEE Communications Society, Nokia Networks and the NYU WIRELESS research center at NYU Tandon School of Engineering. Those who register will enjoy access to this $350 value free of charge.