TU Automotive June 6-7, 2018 Suburban Collection Showplace, Novi 🗓

register
Conference Date: June 6-7, 2018
Time: 8am-5pm
Speaker:

Zack Hicks

Senior Vice President and Chief Information Officer/ Chief Executive Officer and President

Toyota Motor North America/ Toyota Connected, Inc.

Radovan Miucic

Technical Specialist

Changan US R&D Center, Inc

Brigitte Richardson

Lead Speech System Attributes Definition and Research, Sr Engineer

Ford Motor Company

Mike Tinskey

Director, Emerging Services of Connected Vehicle

Ford Motor Company

Jessica Robinson

Director, City Solutions

Ford Smart Mobility

Scott Burnell

Global Lead, Business Development & Partner Management

Ford Motor Company

Alan Hall

Senior Communications Manager, Autonomous Vehicles and Electrification

Ford Motor Company

Gahl Berkooz

Global Chief Analytics, Global Connected Consumer Experience

General Motors

Joseph Buck

Product Cybersecurity Autonomous Vehicle Urban Active Platforms

General Motors

Alex Keros

Smart Cities Chief

General Motors/ Maven

Kelly Helfrich

Manager, Electric Vehicles

General Motors/Maven

Sean Simpson

Investment Manager

GM Ventures

Cason Grover

Senior Group Manager, Vehicle Technology Planning

Hyundai Motor America

Ken Stewart

Chief Strategy Officer

Karma Automotive

Russ Ziegler

Strategic Accounts Manager

Polaris Industries

Matthew Hall

Senior Product Manager, Partnerships

Porsche Digital

Sebastien Henot

Business Innovator

Renault Innovation Silicon Valley

Ryan Eustice

Vice President of Autonomous Driving

Toyota Research Institute

Frank Weith

Director Connected and Mobility Services

Volkswagen Group of America

Aravind Kailas

Research and Innovation Manager, Volvo Group CTO Office

Volvo Group

Sam Abuelsamid

Senior Research Analyst

Navigant Research

Srini Adiraju

Director, Cyber Security

Visteon

Amer Akhtar

COO and Head of US

XPT, a division of NIO

Brian Apley

Strategic Engagement Manager

Akamai

Paul Asel

Managing Partner

NGP Capital

Steven Atneosen

VP – Corporate Development

XPT, a division of NIO

Kris Bailey

COO

Electric Cab of Austin

Jim Barna

Chief Engineer

Ohio DoT

Greg Basich

Senior Analyst – AMCS

Strategy Analytics

Scott Belcher

President & CEO

SFB Consulting

Todd Benoff

Partner

Alston & Bird

Pete Bigelow

Transportation Technology & Mobility Editor

Car & Driver

Hope Bovenzi

Systems Engineer, Automotive Infotainment

TI

Benedikt Brecht

Principal Investigator

Crash Avoidance Metrics Partnership (CAMP)

David Bruemmer

CEO

Adaptive Motion Group

Grayson Brulte

Co-Chair, Mayor’s Autonomous Vehicle Task Force

City of Beverly Hills

Frederic Bruneteau

Managing Director

Ptolemus Consulting Group

James Byun

Global Vice President, Auto

Gracenote

Christine Cavigioli

Senior Vice President – Automotive & Mobility Services

Gemalto

Alan Chakra

Managing Director, Dealer & Fleet Mobility

Deloitte Digital

Barbara Ciaramitaro

Professor, Information Technology and Cybersecurity, Director, Center for Cybersecurity

Walsh College

Denis Cosgrove

Principal Commercial Solutions

Booz Allen Hamilton

Mark de la Vergne

Chief of Mobility Innovation

City of Detroit

Chafik Driouichi

Senior Product Marketing Manager

u-blox

Christopher Emmanuel

Director of Infrastructure and Governance Policy

Florida Chamber of Commerce

Alex Epstein

Senior Director, Digital Strategy & Content.

National Safety Council

Joe Fabbre

Director of Platform Solutions

GreenHills Software

Steven Fernandes

Director of Innovation

Octo North America

Mike Fisher

SVP Mobility and Chief Digital Officer

Hertz

Glenn Fodor

SVP & Head Information and Analytics Solutions

First Data

Faye Francy

Executive Director

Auto-ISAC

Tom Freeman

Senior Vice President – Land Mobile

Kymeta

Pierre Girard

Solutions Security Expert Automotive and Mobility

Gemalto

Nuriel Golan

Director of Vehicle Positioning

Lear

Gail Gottehrer

Partner

Akerman

Sofia Granath

Director Strategy & Product Management

WirelessCar

Stefan Gudmunsson

Principal Automotive Market Development

u-blox

Ted Guild

Research Staff

MIT

Eric Gundersen

CEO

Mapbox

Aaron Guzman

Cyber Safety Advocate

I Am the Cavalry

Jeffrey Hannah

Director – North America

SBD Automotive

Andrew Hart

Director

SBD Labs

Kenny Hawk

CEO

Mojio

Paul Hedtke

Advisor

Valens

Jonathan Hewett

Global CMO

Octo

James Hodgson

‎Industry Analyst

ABI Research

Justin Holmes

Director of Corporate Communications and Public Policy

Zipcar

Jeff Huron

Connected Car Specialist

SBD

Viktor Irle

Founder

EV Volumes

Gregory Jacobs

Managing Director, Emerging Auto Products

Travelers

Stacy Janes

Chief Security Architect

Irdeto

Matt Jones

SVP Software Engineering

Hyperloop One

Matthew Jones

Investor

Anthemis

Liron Kaneti

Product Director

Argus Cyber Security

Liz Kerton

President

Autotech Council

Saurabh Khemka

Senior Vice President and General Manager, IoT/Telematics

Verisk

Billy Kihei

Cyber Safety Advocate

I Am the Cavalry

Danny Kim

Director, Advisory Services

VSI

Fabian Koark

Principal Consultant

Invensity GmbH

Michelle Krebs

Senior Analyst

Autotrader

Roger Lanctot

Director, Automotive Connected Mobility

Strategy Analytics

Sam Lauzon

Automotive Cybersecurity Software Developer

UMTRI

Todd Lawless

Automotive Cyber Security Specialist

Continental

Stephen Lesh

Head of Vehicle Programs

Uber ATG

Jim Levenduski

VP, IoT/Telematics

Verisk

Chan Lieu

Senior Legislative Advisor

Venable

Scott Mackay

Vice President of Digital Commerce Solutions

First Data Corporation

Scott McCormick

President

CVTA

Dariusz Mikulski

Senior Research Scientist

U.S. Army TARDEC

Bradley Miller

Director, Legal and Regulatory Affairs

National Automobile Dealers Association

Michael Morgan

Partner Co-Leader, Global Privacy and Cybersecurity

McDermott Will & Emery LLP

Salim Morsy

Specialist – Advanced Transport

Bloomberg

Dawn Mortimer

AVP, Personal Auto Product Development, IoT/Telematics

Verisk

Roosevelt Mosley

Principal and Consulting Actuary

Pinnacle Actuarial Resources

Kyle Nakatsuji

Founder & CEO

Clearcover

Jason Nelson

Executive Director

Smart Cities Council

Thomas Nigg

Senior Director Product Strategy

u-blox

Cletus Nunes

Director of Sales

Octo Telematics North America

Terry O’Day

Vice President, Product Strategy & Market Development

EVgo

Edwin Olson

CEO

May Mobility

Sheetal Patil

Product Management, Infotainment

Visteon

Anil Rachakonda

Director of Startup Co-operations

co-pace, Continental Startup Program

Michael Ramsey

Research Director

Gartner

Prashanthi Rao Raman

Director of Public Policy

Lyft

Bryan Reimer

Research Scientist

MIT

Pasquale Romano

President & CEO

ChargePoint

Martin Rosell

Managing Director

WirelessCar

Paul Sanderson

Cyber Security Senior Technical Specialist

SBD Automotive

William Sandoval

Vice President of Advanced Platform Applications

KORE

Chris Schreiner

Director of Syndicated Research

Strategy Analytics

Ted Serbinski

Managing Director

Techstars

Jorge Shimabukuro

Chief Security Architect

Visteon

Gideon Shmuel

CEO

eyeSight

Erica Stein

Director, Advanced Solutions Group

United Rentals

John Stockton

VP of Product

AEye

Vishnu Sundaram

Vice President

HARMAN International

Steve Surhigh

VP & GM of Applications Services

HARMAN International

Speaker TBA

Elektrobit

Speaker TBA

.

LexisNexis Risk Solutions

Chris Thomas

Partner

Fontinalis Partners

Eric Totaro

Senior Automotive Analyst

Euromonitor

Richard Wallace

Director, Transportation Systems Analysis

Center for Automotive Research

Holger Weiss

Managing Director & CEO

German Auto Labs

Jim Wheeler

President

ArgoTrak

Clint Wheelock

Managing Director

Tractica

Andrew Whydell

Vice President, Product Planning, Global Systems

ZF

Geoff Wood

Director, Cyber Security

HARMAN

Guang Yang

Director, Principal Architect, Chair of Technical Committee

Baidu USA

Sinan Yordem

Global Ecosystem Manager – 3M™ Connected Roads

3M

Cyril Zeller

SVP Global Sales

Mobile Devices Ingenierie

Location: on the Web
Cost: Standard Pass – Save $100 off your pass before May 4. $2395 (full price $2495), Basic Pass – $1995 (full price $2095) and Automaker Pass – FREE

RSVP: required
Event Details & Registration: (URL for Webinar

Chicago June 27th-July 1st TEMSCON 2018 🗓

AGENDA

                      Friday,  June 29 2018
7:30 – 16:00       Registration (Closed at Lunch)
8:15 – 8:30 Welcome  – Grand Ballroom – 2nd Floor
8:30 – 9:15 KEYNOTE(45minutes) – Topic1: Helen Sun
9:15 – 9:30 Coffee Break & Exhibits (15min)
Track 1: Heritage Ballroom – 2nd Floor
Entrepreneurship/Intrapreneurship
Track 2: Northshore Room – 2nd Floor
Innovation
Track 3: Rogers Room – 9th Floor Disruptive technologies
09:30 -10:15  Snehal Desai, Chief Innovation Officer, Evoqua Looking beyond traditional domains to leverage technology broadly across enterpriseVivek Varma, PhD, PMP
Technology – Cloud Engineering,
Deloitte
Applying insights from the pharma innovation model to physical sciences commercializationSamir Mayekar, Co-founder & CEO, SiNode Systems
10:15-11:00 Jeremy Leval, Director of Product Parknav The role of IP protection in a startup          Dan Brown, CEO of Loggerhead Tools Why Quantum Computing’s Time Has Come?                                                                  Whurley, Founder and CEO, Strangeworks
11:00 – 11:45 Servant Leadership To ReachMy American Dream

Maria Rios, CEO of Nation Waste Inc.

Social Networks For Entrepreneurs and The Role of Mentors                                              Naren Patil, CEO of StartupWind Shahid Ahmed
11:45 – 12:30 KEYNOTE (45 minutes)  Grand Ballroom – 2nd Floor “Innovation DNA” : Christine Schyvinck, CEO of SHURE
12:30 – 13:15 LUNCH (45 minutes) Grand Ballroom – 2nd Floor
13:15 – 14:00 KEYNOTE (45 minutes) Grand Ballroom – 2 Floor Topic tbd :  Chris Gladwin, Ocient
14:00 – 14:15 Coffee Break & Exhibits (15min)
Track 1: Heritage Ballroom – 2nd Floor
Entrepreneurship/Intrapreneurship
Track 2: Northshore Room – 2nd Floor
Innovation
Track 3: Rogers Room – 9th Floor
Disruptive Technologies
14:15 – 15:00 Maven and Connected/Autonomous VehiclesCTO, Urban Active and Maven, General Motors Company Maja Vukovic, Ph.D., Manager, Cognitive Service Management, IBM T.J. Watson Research Center “Biotech Disruptive Technologies”Mohan Rao
15:00 – 15:45 Don McNeeley CEO of Chicago Tube and Iron Simon Hunt, BMW Director of Product Mgmt Success stories transferring science technologies into productJimCorboy, CMO, The Incubator ~ Science Innovation Labs
15:45 – 16:00 Coffee Break & Exhibits
16:00 – 17:30 KEYNOTE PANEL (90 minutes) Grand Ballroom – 2ndFloor “Disruption in Established Industries”:Tony Toulouse Vp of Boeing, Scott McCormick/President Connected Vehicle Trade Association, Danielle DuMerer, CIO of City of Chicago
17:30 – 17:45 Closing Remarks
17:45 – 19:00 Mixer/Reception

WORKSHOPS

Who When What
Shahid Ahmed formerly of PWC and Accenture June 27-all day iIOT applications of technology. Shahid Ahmed, former principal from Accenture and PWC, expert in industrial internet of things. Delivered over two year’s worth of workshops for industrial clients all across the world. Hands on use of development kits will be integrated into the workshop so students will learn how to build their own iIOT solutions
James Northern of IBM June 28afternoon IBM analytics using Bluemix. Bluemix is a powerful set of tools that includes Watson. Valinda Kennedy from IBM will bring in a series of experts from IBM to demonstrate the utility and applications of IBM Bluemix in the morning and IBM Blueworks in the afternoon. She will show how Bluemix and Blueworks can be applied to a variety of business and organizational problems.
Randy Hlavac of Medill school of journalism June 27 All day Marketing analytics tools for working professionals. Professor Randy Hlavac from Medill is an expert in this area and has delivered this topic in one of the most popular Coursera courses ever delivered as measured by dollars of income. This workshop will deal with a variety of tools and techniques for doing in depth quantitative market analysis using readily available databases to help insure the success of your product, business or startup.
Jay Goldstein of Northwestern Farley center June 30 Morning Workshop on agile transformation for organizations
Phil Krone of productive strategies June 30 Afternoon Communication skills workshop: Phil Krone of Productive strategies is proposing a one day workshop on communications for engineers. Phil can supply us with more details as needed.
Oliver Yu June 30 Morning Innovation for the 21st century
Dr. Pieter Frijns. June 30Morning Workshop on Project Management – From a Control to a Learning Perspective
For more details contact:
 
Mark W Werwath (m-werwath@northwestern.edu)
Conference fee structure (in U.S. dollars) 2018 Registration *Dates IEEE Member IEEE Non-Member IEEE Student Member IEEE Student Non-Member IEEE Life Member
Conference early bird registration begins 2/1 $599.00 $699.00 $299.00 $399.00 $299.00
Industry Forum only early bird registration begins $99.00 $149.00 $49.00 $74.00 $49.00
Conference regular registration begins 5/1 $699.00 $799.00 $399.00 $499.00 $399.00
Industry Forum only regular registration begins $149.00 $199.00 $79.00 $99.00 $79.00
Late Registration begins 6/10Late registration ends – 6/25 $799.00 $899.00 $499.00 $599.00 $499.00
Workshops (full priced per day) $99.00 $9149.00 $949.00 $49.00 $99.00
Workshops (half-day) $99.00 $49.00 $49.00 $49.00 $49.00
Other Activities:
Tours (priced per tour) 5/1 till full $89.00 $89.00 $89.00 $89.00
NU MEM dinner with speaker (Saturday 6/30/2018) 5/1-6/25 $89.00 $89.00 $89.00 $89.00 $89.00

USA Central Time is used by the registration system. Deadlines end before midnight.

For more details contact:

Bakul Banerjee (bakulb@gmail.com)

Utilizing Electrical Test Methods for Thermal Measurement, Reliability and Quality Assessment 🗓

Utilizing Electrical Test Methods for Thermal Measurement, Reliability and Quality Assessment


We continue our sequence of in-depth tech events for the year with a talk on test methods for electronic devices

From multi-core chips in slim smartphone devices or compact packaging of power semiconductor modules for lightweight electric vehicle inverters, understanding semiconductor package heat dissipation remains important for performance and product reliability purposes.

This presentation introduces electrical test methods covered by JEDEC 51-1 standards.  By utilizing this approach, the difficulties and problems measuring temperature at the component’s die are overcome.  Further use of the techniques allow transient thermal response measurement, for package and system thermal characterization, which can be applied to identifying thermal degradation, verifying package material quality for manufacturing purposes, and supporting thermal design processes by generating validated semiconductor package thermal models. This method is an alternative to XRay, CSAM or destructive inspection methods for certain failure diagnosis applications.

Key topics:

–          Electrical test methods for thermal measurement, JEDEC 51-1 series, transient thermal response & structure functions

–          Package material structure object mapping

–          Power Electronics – IGBT thermal degradation identification & power cycling studies

–          Package Material Defect Identification

–          Recent IP developments in detailed thermal model calibration

Following this there will a general discussion, Q&A and update on the current state of landscape (recent major annoucenments will be also shared)

 

Date and Time

Location

Staticmap?size=250x200&sensor=false&zoom=14&markers=42.6688483%2c 83

Contact

Registration

  • No Admission Charge
  • Starts 05 March 2018 09:22 AM
  • Ends 28 March 2018 09:22 PM
  • All times are US/Eastern
  • Menu: Vegetarian Pizza, Cheese Pizza, Regular Soda Pop, Diet Soda Pop

 

Speakers

Joe Proulx

Joe Proulx of Mentor Graphics

 

Topic:

Utilizing Electrical Test Methods for Thermal Measurement, Reliability and Quality Assessment

 

Agenda

6:00 PM – Welcome and Introductions, Chapter business update, Pizza

 

6:15 PM – Main Presentation: Utilizing Electrical Test Methods for Thermal Measurement, Reliability and Quality Assessment

 

7:30 PM – Post event discussion, Q&A and landscape update

 

7:45 PM – Wrap Up

 

7:45 to 8 PM – Networking

 

 

 

A Joint Oakland University/IEEE Computer Society/Education Chapter Presentation, open to all 

September 17-20, 2018: Three EMC Short Courses by LearnEMC in Detroit, MI – 10% discount for IEEE members 🗓

September 17-20, 2018: Three EMC Short Courses by LearnEMC in Detroit, MI

Design for Automotive EMC Compliance – 9/17 & 9/18

Automotive Printed Circuit Board Layout – 9/19

Power Electronics Design for Electromagnetic Compatibility – 9/20

 Design for Automotive EMC Compliance

Details

Registration for September Short Courses

Price: $1195 (10% discount for IEEE members, use code IEEE-EMC at checkout)

 Date: September 17-18, 2018

Time: 8:00 am – 5:00 pm

Instructor: Dr. Todd Hubing, President of LearnEMC and past-president of IEEE EMC Society

This course stresses the fundamental concepts and tools that electronics engineers can employ to avoid electromagnetic compatibility and signal integrity problems in automotive systems. Students completing the course will be able to make good decisions regarding board layout and system design for EMC. They will also be introduced to tools and techniques for quickly reviewing designs in order to flag potential problems well before the first hardware is built and tested.

Automotive Printed Circuit Board Layout

Details

Registration for September Short Courses

Price: $595 (10% discount for IEEE members, use code IEEE-EMC at checkout)

Date: September 19, 2018

Time: 8:00 am – 5:00 pm

Instructor: Dr. Todd Hubing, President of LearnEMC and past-president of IEEE EMC Society

Printed circuit board layout is often the single most important factor affecting the electromagnetic compatibility of automotive systems. This course stresses the fundamental concepts and tools that board designers must be familiar with to meet automotive EMC requirements. Students completing the course will be able to make good decisions regarding component selection, component placement, and trace routing. In addition, students will have the knowledge and tools necessary to design effective power distribution and grounding strategies for automotive printed circuit boards.

 Power Electronics Design for Electromagnetic Compatibility

Details

Registration for September Short Courses

Price: $595 (10% discount for IEEE members, use code IEEE-EMC at checkout)

Date: September 20, 2018

Time: 8:00 am – 5:00 pm

Instructor: Dr. Todd Hubing, President of LearnEMC and past-president of IEEE EMC Society

This 1-day course covers fundamental and advanced design concepts related to the design of power electronic circuits for meeting electromagnetic compatibility requirements. In the morning session, basic power electronic circuit topologies and applications are reviewed with a focus on the fundamental properties of these circuits that result in unwanted conducted and radiated emissions. Noise source models are presented and various noise mitigation options are examined. The focus of the afternoon session is on advanced design concepts including grounding strategies, component selection and placement, and methods for maintaining electrical balance. Active noise cancellation techniques applicable in various situations are also presented. Finally, examples of good and bad power circuit designs ranging from low-voltage DC-to-DC converters to 700-volt electric vehicle motor drives are reviewed.

May 22-24: Two EMC Short Courses by LearnEMC in Stoughton, WI – 10% discount for IEEE members 🗓

May 22-24: Two EMC Short Courses by LearnEMC in Stoughton, WI

Electronic Systems Design for EMC Compliance – 5/22 & 5/23

Advanced Printed Circuit Board Design for EMC – 5/24

 Electronic Systems Design for EMC Compliance

Details

Registration for May Short Courses

Price: $1195 (10% discount for IEEE members, use code IEEE-EMC at checkout)

Date: May 22-23, 2018

Time: 8:00 am – 5:00 pm

Instructor: Dr. Todd Hubing, President of LearnEMC and past-president of IEEE EMC Society

 This course stresses the fundamental concepts and tools that electronics engineers can employ to avoid electromagnetic compatibility and signal integrity problems. Students completing the course will be able to make good decisions regarding board layout and system design for EMC. They will also be introduced to tools and techniques for quickly reviewing designs in order to flag potential problems well before the first hardware is built and tested.

 Advanced Printed Circuit Board Design for EMC

Details

Registration for May Short Courses

 Price: $595 (10% discount for IEEE members, use code IEEE-EMC at checkout)

 Date: May 24, 2018

Time: 8:00 am – 5:00 pm

Instructor: Dr. Todd Hubing, President of LearnEMC and past-president of IEEE EMC Society

 This is an advanced course for engineers who design products that must comply with EMC requirements on the first test pass. The course discusses basic methodologies for reviewing circuit board layouts and schematics to identify and evaluate potential EMC and signal integrity issues. Examples derived from actual circuit board designs are used to illustrate proper and improper layouts in various situations. Implementation and layout strategies for various types of circuits are reviewed including high-speed digital, RF analog, LF analog, power inverters, controllers and mixed-signal designs.

 It is assumed that students taking this course have a basic understanding of fundamental EMC concepts. (For example, students that have completed the Electronic Systems Design for EMC Compliance course or the Design for Automotive EMC Compliance course.) The focus of the course will be on the application of these concepts to actual product designs. Students completing this course will have the skills necessary to conduct well-organized circuit board design reviews and make good decisions regarding component selection, component placement, layer stack-up, trace routing and grounding.

Robofest – Lawrence Technological University – May 19 @ 08:30 – 16:30 EDT 🗓

Robofest
May 19 @ 08:30 – 16:30 EDT

Interested in knowing about Robofest?
Of course that everyone is welcome to attend but what about learning and being a technical judge for the event?
If you would like to participate as a judge please let Prof. CJ Chung, cchung@LTU.edu, know.

Videos and more information about Robofest can be found here: http://www.robofest.net/

Please note that anyone is welcome to Robofest! Even if you just stop by to check it out!

Robofest is a program started in Southeast Michigan. It is sponsored by IEEE SEM and growing nationally and internationally. This year over 2,500 students participated in 17th annual Robofest in 14 US States and 10 countries. In Michigan alone this academic year, we had 200+ teams with 700+ students.
Robofest has a competition category called Exhibition similar to a science fair only for intelligent robotics projects built and programed by K-12 students.
IEEE R&A members (and non-members) are invited to serve as an Exhibition Judge on

Sat. May 19, 8:30am ~ 4:20pm

for Robofest Michigan Championship at Lawrence Technological University in Southfield.

Judging rubric in PDF can be found at:
http://www.robofest.net/2016/robofestExhRubric.pdf

All the judges are requested to send him a short bio by May 14.

A sample bios last year can be found on the web at:
http://robofest.net/2015/Exhibition_Judge_Bios.pdf

Location: Lawrence Technological University

Address and directions to LTU: http://www.ltu.edu/sitemap/directions.asp

Building: Follow the Robofest signs to navigate within the campus: http://www.ltu.edu/map/LTU-Campus-Map.pdf

Parking: Parking map http://www.ltu.edu/map/LTU-Campus-Map.pdf

Agenda:

Several competitions run in parallel from 8:30am ~ 4:20pm.

Details can be found at http://www.robofest.net/

Location:
Bldg: Follow Robofest signs
21000 W 10 Mile Rd
Southfield, Michigan
48075

Embassy Suites Livonia – EMC Fest – 2018 May 10 @ 08:30 – 16:30 EDT 🗓

EMC Fest 2018
May 10 @ 08:30 – 16:30 EDT
EMC Fest ‘2018

May 10, 2018

Topics: See Agenda Below

Important Registration Information – Please read First!

Location: Embassy Suites 19525 Victor Parkway, Livonia, Michigan,48152, USA

The Art and Science of EMC Design – Colin Brench
Colin is a joint author of the following Kindle textbook available on Amazon for $23.74:

EMI/EMC Computational Modeling Handbook – 2nd Edition, Kindle Edition
Note: Early Registration Prices end April 21, 2018 at 12:01 AM

FEE SCHEDULE

IEEE Members Registered Before April 21 $50

Non-Members Registered Before April 21 $75

IEEE Student Members Before April 21 $25

Vendor Extra Staff Before April 21 $50

Retired / Unemployed IEEE Members Before April 21 $25

CEU Units *$25

EMI/EMC Computational Modeling Handbook (Kindle)*$23.74

All Late or At the Door $100

NO REFUNDS AFTER April 21.

* Requires additional use of registration system or Amazon.

To register a vendor table, or to add extra vendor table staff, please go to page: To Be Announced

Chapter website: http://www.emcsociety.org

To be added or removed from the Southeastern Michigan IEEE EMC email list, please send an email to scott@emcsociety.org with ADD or REMOVE as the subject. If this email was forwarded to you, please reply with REMOVE as the subject

Speaker(s): Colin Brench,

Agenda:

Program Outline: Thursday May 10, 2018
6:00 Vendor Table Setup (till 8:30)
8:00 REGISTRATION & EXHIBITS
8:30 CONTINENTAL BREAKFAST
9:00
Session 1 – The Science of EMC Design

This will look at the underlying physics of different topics; such as shielding, antennas, and coupling. Also the details of what is actually known will be considered.
10:00 Break & Exhibits
11:00
Session 2 – The Tools Used for EMC Design
In this section, the means of solving the above physics problems will be covered, that is; computational techniques, analytic techniques and more. Here the importance of what is not known will also be discussed
12:00 LUNCH
1:00
Session 3 – The Art of EMC Design
The correct application of the tools will be covered in this piece. Understanding the tools’ true capabilities to address a given problem and their limitations will be the focus. The importance of the engineer’s existing skills is a major component at this stage of a design.
2:00 Break & Exhibits
3:00
Session 4 – Design Verification and Validation

Validation of a design will include various measurements and the use of alternate design tools to confirm the design expectations. All of this finally comes together at the qualification stage, but by this point the EMC design engineer should know what risks exist and have backup plans in place.
4:00 Reception
5:00 Close of EMC Fest
NOTE: breaks will be scheduled at the speaker’s discretion. Table-top displays (exhibits) will be open during registration, lunch, all breaks, and the reception. Access to the table-top displays is available during the technical sessions, but the displays may not be manned during those times.

Hotel Information: Embassy Suites is offering a limited number of reduced rate rooms for $121. Internet, Pool, Cocktail Reception and breakfast buffet are included. You must mention “Group ID: EMC Fest 2018” to get this special rate and reserve your room by April 13. After which rooms and rates are subject to availability. The Embassy Suites Hotel is located 22 miles from Detroit Metropolitan Airport. From I-275 take the 7 Mile Road – East. Travel approximately 1/4 of a mile to Victory Parkway. Turn left on proceed approximately 1/4 mile. Embassy Suites will be on the left . Contact (734) 462-6000 to make arrangements. Airport shuttle is not available so plan a taxi or car to travel to the hotel.

Location:
Bldg: Embassy Suites
19525 Victor Parkway
Livonia, Michigan
48152

Tuesday Feb 6th 9:00 am to 4:30 pm 2018 Automotive EMC Design & Test Seminar Automation Alley 2675 Bellingham Troy, MI 48083 🗓

Automotive EMC Seminar

Automotive EMC Design & Test Seminar!

Troy, MI
February 6, 2018

Please join us at the Automotive EMC Design & Test Seminar on February 6th!

Learn from respected experts in your field. We’ll have great speakers ready to share their vast knowledge with you. Lunch will be provided!

Dan Beeker from NXP is our primary speaker along with others from leading EMC solution providers such as NEC, Oak-Mitsui and API where they’ll present their latest EMC design and debugging solutions.

Date: February 6th 9:00 am to 4:30 pm
Location:

Automation Alley
2675 Bellingham
Troy, MI 48083

Cost: Free

Agenda

9:00AM-9:30AM

Registration

9:30AM-11:00AM

Power Distribution Made Easy

11:00AM-Noon

How to Mitigate EMI from Switching Mode Power Supply Using EMIStream

Noon-1:00PM

Lunch and Product Fair

1:00PM-2:00PM

Benefits for Advanced Thin Dielectrics to Optimize the Power Delivery Networks

2:00PM-3:00PM

Near-Field Scanning: Searching for Root Causes

3:00PM-3:15PM

Break and Product Fair

3:15PM-4:15PM

Keysight Overview of Tools for the EMC Lab

4:15PM-4:30PM

Wrap Up

Presentation 1
Power Distribution Made Easy by Dan Beeker
NXP Semiconductors
Principal Engineer, Automotive Field Applications Engineering

ChiliDan

This presentation will present a simple EM physics and geometry based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed can be used to reduce power supply noise and improve EMC.

This course will, after an introduction to EM field behavior, describe several effective methods for designing the spaces which are used to deliver power on a PCB. These methods are driven by considerations for how fast the switches are changing states, and the geometry of the spaces and placement of components to properly delivery energy to prevent EMC and signal integrity issues.

Presentation 2
How to Mitigate EMI from Switching Mode Power Supply Using EMIStream by Yoshiaki Maruyama
NEC
Engineering Manager

Maruyama_NEC

Agenda

In recent years, automotive EMC is becoming more important especially EMI from power supply circuit would affect AM/FM band. In this talk, we will cover how to mitigate EMI from switching mode power supply and also resonance from power plane. We will show you a case-study as well as comparison between simulation and measurement.

Presentation 3

Benefits for Advanced Thin Dielectrics to Optimize the Power Delivery Networks by Bob Carter
Oak-Mitsui
Vice President of Technology and Marketing

BobCarter

Agenda

· Power Delivery Network

· Benefits/Improvements using Thin Dielectrics

· Applications where this is being used today: Automotive, Network, Aerospace, Medical, Telecom, RF, MEMS and Sensors, and Chip Packages, etc.

· Technical Data/Case Studies

· Wrap

Presentation 4

Near-Field Scanning: Searching for Root Causes by Hamed Kajbaf
Amber Precision Instruments
Principal EMC Engineer

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Agenda

· Near-field effects of electrostatic discharge events

· Conducted susceptibility: where does ESD current go?

· Sniffer probes are smarter than they look

· Electromagnetic lens: from near-field to far-field

·

Presentation 5

Keysight Overview of Tools for the EMC Lab by John Kinney
Keysight Technologies
RF and Microwave Application Engineer

https://toyotechus.com/wp-content/uploads/2018/01/Kinney-150×150.png

Agenda

With Connected Car applications there is a range of tools Keysight offers for the EMC lab, ranging from RF Power Meters, RF Signal Sources, to Pre-Compliance Analyzers, Compliance Analyzers, and VNA’s (Vector Network Analyzers) for applications like EMC Test and Debugging, Signal Integrity, TDR (Time Domain Reflectometry), and the Ford RI-115 requirements. In addition Bases Station Emulators and Channel Faders are finding their way into EMC labs to support Connected Car Application.

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April 24th-26th 2018 AECQ Reliability Council Sheraton Detroit Novi MI 🗓

he Automotive Electronics Council (AEC) was originally established by Chrysler, Ford, and GM for the purpose of establishing common part-qualification and quality-system standards. From its inception, the AEC has consisted of two Committees: the Quality Systems Committee and the Component Technical Committee. Today, the committees are composed of representatives from the Sustaining Members (currently Autoliv, Bose Corporation, Continental Corporation, Cummins, Delphi Corporation, Denso International America, Gentex Corporation, Harman, Hella, John Deere Electronics Solutions (Phoenix International), Kostal Automotive, Lear Corporation, Magna Electronics, Sirius XM, Valeo, Visteon Corporation and ZF TRW Automotive) and other Technical, Associate, and Guest Members.

The AEC Component Technical Committee is the standardization body for establishing standards for reliable, high quality electronic components. Components meeting these specifications are suitable for use in the harsh automotive environment without additional component-level qualification testing. This web site makes available the technical documents developed by the AEC Component Technical Committee. These documents can be downloaded directly.

Saturday, March 24, 2018 K-12 STEM Poster Competition For High School, Middle School and Elementary Students Lawrence Technological University Campus, Southfield 🗓

— Saturday, March 24, 2018 K-12 STEM Poster Competition For High School, Middle School and Elementary Students Lawrence Technological University Campus, Southfield
K-12 STEM Poster Competition
For High School, Middle School and Elementary Students
Saturday, March 24, 2018
Lawrence Technological University Campus, Southfield
Architecture Auditorium and Gallery (A200 & A210)

http://ieomsociety.org/ieom/stem-michigan-2018/

Lawrence Technological University and IEOM Society International, a 501(c)(3) nonprofit organization, are jointly organizing IEOM STEM Poster Competition for middle school, high school and elementary students on March 24, 2017 (Saturday). Students can create a poster illustrating your project in science, technology, engineering, or mathematics (STEM) and present it to industry professionals in the STEM fields.

Interested High School and Middle School students should a title and a short summary online: https://www.xcdsystem.com/IEOM/abstract/index.cfm?ID=JLjk7G1

Participants need to bring a poster printed or any school project posters to the event in the area of Science, Technology, Engineering and Mathematics (STEM). Recommended size 36″ x 24-48″ (36 inches high by 24-48 inches wide). Posters will be judged in the each age categories: K-12. Winners will be awarded certificates and 1st, 2nd & 3rd place winners of each grade will receive a gift card of $20 each. Any students from K-12 institution in Michigan can join the competition.

All participants will receive attendance / presentation certificates.

Tentative Program

08:00 – 10:00 Registration

10:00 – 13:00 Poster Competition (K-12)

13:00 – 14:00 Lunch and Keynote

14:00 – 15:00 Winners Recognition and Certificates Distribution

ADMISSION IS FREE

$20 GIFT CARD for 1st, 2nd and 3rd place winners of each grade level. A total of 50 gift cards will be given.

Contact:

Dr. Ahad Ali (aali@ltu.edu) and Professor Don Reimer (dreimer@ltu.edu)
Co-Chairs: IEOM STEM Poster Competition Michigan 2018

http://ieomsociety.org/ieom/stem-michigan-2018/

Sponsors

ASQ – Greater Detroit Section
Lawrence Technological University

Sponsorship opportunities are available.

Student’s participation in the STEM Poster Competition can be helpful for their Portfolio Development for extra curriculum activities including project presentation, attendance certificate, team participation, leadership, publications and networking.