Utilizing Electrical Test Methods for Thermal Measurement, Reliability and Quality Assessment 🗓

Utilizing Electrical Test Methods for Thermal Measurement, Reliability and Quality Assessment

We continue our sequence of in-depth tech events for the year with a talk on test methods for electronic devices

From multi-core chips in slim smartphone devices or compact packaging of power semiconductor modules for lightweight electric vehicle inverters, understanding semiconductor package heat dissipation remains important for performance and product reliability purposes.

This presentation introduces electrical test methods covered by JEDEC 51-1 standards.  By utilizing this approach, the difficulties and problems measuring temperature at the component’s die are overcome.  Further use of the techniques allow transient thermal response measurement, for package and system thermal characterization, which can be applied to identifying thermal degradation, verifying package material quality for manufacturing purposes, and supporting thermal design processes by generating validated semiconductor package thermal models. This method is an alternative to XRay, CSAM or destructive inspection methods for certain failure diagnosis applications.

Key topics:

–          Electrical test methods for thermal measurement, JEDEC 51-1 series, transient thermal response & structure functions

–          Package material structure object mapping

–          Power Electronics – IGBT thermal degradation identification & power cycling studies

–          Package Material Defect Identification

–          Recent IP developments in detailed thermal model calibration

Following this there will a general discussion, Q&A and update on the current state of landscape (recent major annoucenments will be also shared)


Date and Time


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  • No Admission Charge
  • Starts 05 March 2018 09:22 AM
  • Ends 28 March 2018 09:22 PM
  • All times are US/Eastern
  • Menu: Vegetarian Pizza, Cheese Pizza, Regular Soda Pop, Diet Soda Pop



Joe Proulx

Joe Proulx of Mentor Graphics



Utilizing Electrical Test Methods for Thermal Measurement, Reliability and Quality Assessment



6:00 PM – Welcome and Introductions, Chapter business update, Pizza


6:15 PM – Main Presentation: Utilizing Electrical Test Methods for Thermal Measurement, Reliability and Quality Assessment


7:30 PM – Post event discussion, Q&A and landscape update


7:45 PM – Wrap Up


7:45 to 8 PM – Networking




A Joint Oakland University/IEEE Computer Society/Education Chapter Presentation, open to all 



Please Join the Power and Energy and Industrial Applications Society for a guest lecture.

Dinner will be provided and PDH credits will be available upon request.

Vacuum circuit breaker switching induced transients can cause frequency induced medium voltage transformer dielectric damage where the two are coupled with short cable.  The most common mitigation method is to add a resistor/capacitor snubber at the transformer terminals.  While this approach has proved highly effective, there is little discussion of variations on the snubber application.  This paper describes the results of switching tests of a vacuum circuit breaker connected to a 1 MVA transformer through medium voltage cable.  First, the mechanism was investigated.  The tests show the resonance is induced by the broad band frequency content due to the high dv/dt of the circuit breaker current chopping and the chopping rate.    Next, snubber performance at various circuit locations was tested.  The snubber was most effective at the transformer medium voltage terminals and at the load side of the circuit breaker.

Date and Time


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  • No Admission Charge
  • Starts 08 March 2018 08:36 AM
  • Ends 27 March 2018 05:00 PM
  • All times are US/Michigan
  • Menu: Regular, Vegetarian

Webinar – March 21, 2018 11:00 am IEEE 5G Webinar- The Future of IoT 🗓

Date and time: Wednesday, March 21, 2018 11:00 am
Eastern Daylight Time (New York, GMT-04:00)
Change time zone
Wednesday, March 21, 2018 8:30 pm
India Time (Mumbai, GMT+05:30)
Wednesday, March 21, 2018 4:00 pm
Europe Time (Paris, GMT+01:00)
Duration: 1 hour
IEEE 5G Webinar Invite | Register today for March 21, 2018 11:00am ET

The IEEE 5G Initiative is engaging professionals worldwide from industry, government, and academia to collaborate on the challenges associated with 5G and lay the foundation to realize its many opportunities. Members of the community have access to extensive resources including publications, videos, articles, interviews, webinars, newsletters, workshops, and conferences.

Complimentary Webinar

The Future of IoT

February 21, 2018 | 11:00am – 12:00 pm ET


Don DeLoach, Co-Chair, Midwest IoT Council

About the Webinar

As the Internet of Things moves closer and closer to mainstream, and the potential impact on our organizations becomes clearer, the challenges uncovered through numerous pilots and early production systems are becoming clear as well. In his presentation, Don will explore these challenges that often have less to do with technology, and more to do with people, organizations, architecture, and somewhat nuanced but no less critical considerations of security, privacy, and data ownership. The challenges in moving from early stages of the Internet of Things into mainstream production can demand a broad level of understanding and thoughtful leadership in order to truly leverage IoT’s value in a resilient manner.

About the Speaker

Don DeLoach is an entrepreneur, author, board member, and a leading industry evangelist for the Internet of Things. Don has been CEO of three software companies over the last 18 years, including Youcentric, Aleri, and Infobright. He is currently co-chairman of the Midwest IoT Council. He also sits on the executive board of the Array Things (NSF-funded smart cities project), and in 2017, co-authored the book “The Future of IoT” with Gartner analyst Emil Berthelsen and Hitachi/Pentaho executive Wael Elrifai.

Please register to attend today and join us on Wednesday, March 21st from 11am – 12pm EDT

Webinar – Enhancing Vehicle Dynamics and Energy Efficiency in Electric Vehicles with Multiple Motors Via Torque Vectoring Thursday, April 12, 2018 – 11:00am ET – 12:00pm ET 🗓

Enhancing Vehicle Dynamics and Energy Efficiency in Electric Vehicles with Multiple Motors Via Torque Vectoring
Thursday, April 12, 2018 – 11:00am ET – 12:00pm ET
Presenter: Basilio Lenzo
Sheffield Hallam University, UK

Abstract: Electric vehicles with multiple motors allow torque-vectoring (TV), i.e. the individual control of each drivetrain. TV has been largely studied in the literature since it can provide significant benefits in terms of vehicle safety and drivability. This webinar analyses recent experimental results of the EU FP7 Projects EVECTOORC and iCOMPOSE, in which torque vectoring is exploited for: i) enhancing vehicle dynamics; ii) maximising energy efficiency.

TV can enhance the handling qualities of a vehicle well beyond the capabilities achievable with conventional stability control systems, as it intervenes seamlessly and continuously without variation of the net traction force. A direct yaw moment can be generated through different torque allocation at the left and right sides of the vehicle, allowing the design of the cornering response of the vehicle. For instance, a “Sport” driving mode was designed to reduce the understeer gradient, extend the region of linear vehicle operation, and increase the maximum lateral acceleration compared to the passive vehicle.

As regards energy efficiency improvement, a simple and effective torque distribution strategy was developed. Basically, the torque demand on each vehicle side is compared to a “switching torque” value (function of the vehicle speed) which is defined based on the experimental measurements of the drivetrain power loss characteristic. The developed energy efficient torque distribution algorithm allows energy savings typically between 2% and 3% along common driving cycles, and up to ~4% during cornering conditions with respect to fixed torque distribution strategies.

REGISTRATION IS COMPLIMENTARY, so please sign up and join us.


Webinars – Control Challenges in Automotive Electrical Traction Drives Thursday, March 15, 2018 – 1:00pm ET – 2:00pm ET 🗓

Control Challenges in Automotive Electrical Traction Drives
Thursday, March 15, 2018 – 1:00pm ET – 2:00pm ET
Presenter: Sabin-Constantin Carpiuc

Abstract: Vehicle electrification is a key research direction in the automotive business, with many challenging problems and opportunities arising. An important part in automobile electrification is represented by the electric drive with integrated electric machine, power electronics, high voltage battery and real-time control software. However, the implementation in a micro-controller based embedded system is a difficult task because these applications are characterized by fast dynamics that are subject to hard physical and control constraints. Therefore, it yields a complex embedded platform that must meet tough requirements and compulsory safety standards. The goal of this presentation is to discuss the operation of automotive electrical traction drives at the system level and to analyze the arising control challenges. The talk will cover aspects from modeling, control, hardware implementation and testing in automotive electrical traction drives. The talk will also include relevant case studies.

REGISTRATION IS COMPLIMENTARY, so please sign up and join us. https://register.gotowebinar.com/register/2773681193637632771

April 19th – Farmington Hills – Power Measurement and Analysis of Switched-Mode Power Supplies 🗓

Date: 19 April 2018
Time: 05:30 to 07:30

27007 Hills Tech Ct
Farmington Hills, Michigan
United States 48331
Building: Teledyne LeCroy Automotive


Topic: Power Measurement and Analysis of Switched-Mode Power Supplies

Mike Hertz has been a Field Applications Engineer with Teledyne LeCroy in Michigan for 17 years. Before joining Teledyne LeCroy, he worked in
Applications and Marketing with both Agilent Technologies and Hewlett-Packard in Colorado. He holds a BSEE from Iowa State University and an MSEE from the University of Arizona. Hertz is an Eta Kappa Nu electrical engineering honorary recipient, has published over 50 articles in the field of test and measurement, and has been awarded 6 U.S. patents in oscilloscope measurement design.

Bloomfield Hills – April 10th – Trends in Vehicle Access 🗓

Trends in Vehicle Access
The presentation will give an overview of the operation of Passive Entry/Passive Start systems today and how they operate. Known by other names such as Keyless Go or Push N Drive, the systems are used in vehicles today for driver convenience. It is the reason that you can keep your FOB in your pocket and only push the button to start. I will speak about current technology, security and future vision with regard to this technology.


Mr. Kollman is the owner of Haynes-Bent and has been consulting for about 20 years for radio frequency hardware, EMC and general engineering topics. He is also an adjunct professor at the University of Illinois at Chicago.

March 15th Canton – Causes of Radiation? 🗓

Date: 15 March 2018
Time: 05:30 PM to 07:30 PM
2100 N. Haggerty Rd
Canton, Michigan
United States 48187
Building: Al Ameer Restaurant

Topic: What Causes Radiation
Abstract: The field of EMI/EMC shares its heritage with antenna and propagation engineers, on the one hand, and physicists on the other. For the former group, much of the 20th century was spent on developing ways to predict the radiation due to some source through complex analytical and numerical schemes. Physicists, on the other hand, are interested in making the connection between the movement of the elementary charged particle, the electron, and the radiated field. Since the field of EMI/EMC engineering is related to a large degree to radiation, EMI/EMC engineers would naturally be interested in the work of these two groups. However, EMI/EMC engineers have keen interest in understanding which sources/currents are the ones that cause radiation; a question that is typically ignored by the two groups of physicists and propagation engineers. After all, if the source of radiation is found, containing it becomes easier than not knowing it in the first place. In this talk we explore the fundamental question of “what causes radiation” from a purely practical and engineering-relevant perspective. We show that powerful numerical schemes, circuit models, and analytical techniques, while potentially providing elegant and full solution to the radiating problem, fail to highlight the physical phenomenon of interest to EMI/EMC engineers in the first place unless careful attention is paid to… the fundamental sources of radiation!


Omar M. Ramahi received the BS degrees in Mathematics and Electrical and Computer Engineering from Oregon State University, Corvallis, OR. He received his M.S. and Ph.D. in Electrical and Computer Engineering from the University of Illinois at Urbana-Champaign. From 1993 to 2000, he worked at Digital Equipment Corporation (presently, HP), where he was a member of the alpha server product development group. In 2000, he joined the faculty of the James Clark School of Engineering at the University of Maryland at College Park as an Assistant Professor and later as a tenured Associate Professor. At Maryland he was also a faculty member of the CALCE Electronic Products and Systems Center. Presently, he is a Professor in the Electrical and Computer Engineering Department. He is a co-author of the book EMI/EMC Computational Modeling Handbook, 2nd Ed. Professor Ramahi has served as a consultant to several companies. Professor Ramahi won the Excellent Paper Award in the 2004 International Symposium on Electromagnetic Compatibility, Sendai, Japan, and the 2010 University of Waterloo Award for Excellence in Graduate Supervision. In 2012, Professor Ramahi was awarded the IEEE Electromagnetic Compatibility Society Technical Achievement Award. Dr. Ramahi is an elected IEEE Fellow. In 2009, he served as a Co-Guest Editor for the Journal of Applied Physics Special Issue on Metamaterials and Photonics. From 2007-2015, he served as an Associate Editor for the IEEE Transactions on Advanced Packaging. From 2010-2012, he served as an IEEE EMC Society Distinguished Lecturer. In 2014, he served as a Guest Editor for the journal Sensors, special issue on Metamaterial-Inspired Sensors. He has authored over 390 journal and conference papers.

Email: mkirkhar@umich.edu
Address:Waterloo, Ontario, Canada

Chapter website: http://www.emcsociety.org To be added or removed from the SE Michigan IEEE EMC email list, please send an email to scott@emcsociety.org with ADD or REMOVE as the subject.

May 5 Troy Community Center – Governmental Regulation & Engineering: Intersection of Policy & Advocacy 🗓

Governmental Regulation & Engineering: Intersection of Policy & Advocacy
Saturday, May 5 9:30AM – 2PM
Troy Community Center in Troy, MI
Speakers include:

Rodney Cole: State Government Policy and Advocacy: Industry Perspective

Jennifer Dukarski: Regulations for Preserving Privacy in Biometrics

Bob Neff: Vehicle Communications to Facilitate Autonomous Vehicles

Henrique Martins: An Overview of the Global Automotive Regulatory Framework and Certification Process

More information is available at:

Spring 2018 Section Conference

Or register at:


March 28 – Lawrence Technological University – IEEE RAS – Multimodal Sensing of Human Behavior 🗓

IEEE RAS – Multimodal Sensing of Human Behavior
March 28 @ 18:00 – 19:15 EDT
IEEE Robotics and Automation Societies is pleased to host Assistant Professor Mihai Burzo from University of Michigan.

IEEE members and non-members are welcome to attend.

It is encouraged to register to have an accurate count to order food for the event.

Registration is free. Pizza and soft drinks will be provided.

Speaker(s): Mihai Burzo,


6:00PM – Brief Introduction and welcome – Food available on the table

6:10PM to 7:00PM Technical Presentation

7:00PM to 7:15PM Networking

7:15PM Adjourn

Room: Room J234
Bldg: Building 4 – Alfred Taubman Engineering Complex
Lawrence Technological University
21000 West 10 Mile Road, Southfield, MI USA 48075
Southfield, Michigan